How System Basis Chips rise to the power and reliability challenges for future-proof electrification and autonomous vehicle electronic control unit designs.
Erwan HEMON is Vice President of Technology and Innovation in NXP semiconductors working in Business Line Advanced Analog responsible for IP development, Technology, ESD-EMC Center of excellence and Back End activities. He has been in this role since 2016 based in Toulouse (France).In addition, Erwan HEMON is the CTO and General Manager of Energy and Lighting Business Line for DATANG NXP Semiconductors, responsible for BMS (Battery Monitoring Systems) product development. Prior this he worked 10 years for Freescale as R&D Director for Analog division (based in Phoenix and Toulouse) , and 10 years for Motorola Semiconductors as design manager where he managed the Toulouse design centers (France), focused on mixed signal design in smart-power technology for use in automotive and Power Over Ethernet applications. Over those years he worked on products for applications like BMS (Battery Monitoring Systems), Airbags, Braking systems (ABS, ESP), Automotive networking transceivers, Motor driver (H-bridge, 3Ph motor drivers), DFI (Direct Fuel Injection), Engine Management , Power Management, E-switch (electronic switches) and is familiar with most automotive related processes like AECQ100, ISO2626 (functional safety) , ESD and EMC . Before joining Motorola Semiconductors, he worked as a design engineer at Philips Semiconductors in Caen (France) on various analog products for Hard Disk Drive market as well as telephony ICs. Over all he has been working on Mixed Signal IC development for 30 years and hold more than 10 patents granted in those area. Erwan Hemon graduated as an electronic engineer from the French Grande Ecole "ENSERG" Grenoble's National Institute of Electronics and Radio-Electricity in 1990.
As the semiconductor industry inexorably extends demands on power and safety for complex automotive systems, system-on-chips need to deliver more performance for longer than ever before. With the automotive market on the brink of cost parity for electric vehicles and the need for autonomous and connectivity features rising orthogonally to those of the powertrain; features need to be further integrated to continue reducing cost for car makers. This implies some unique new challenges for semiconductor designs to support these features safely and reliably.