Committee Members
Organizing Committee
General Chair: | |
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Kimimori Hamada |
PDPlus LLC., Japan |
Technical Program Committee Chair: | |
Ichiro Omura |
Kyushu Institute of Technology, Japan |
Past General Chair: | |
Oliver Haeberlen |
Infineon Technologies, Austria |
Vice General Chair: | |
Wai Tung Ng |
University of Toronto, Canada |
Kevin Chen |
Hong Kong University of Science and Technology, China |
Nando Kaminski |
University of Bremen, Germany |
Secretariat: | Kozo Kato | Mirise Technologies Corporation, Japan |
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Treasurer: | Tomohide Terashima | Mitsubishi Electric Corporation, Japan |
Short Course: | Yuichi Onozawa | Fuji Electric Co., Ltd., Japan |
Social Event: | Katsumi Nakamura | Mitsubishi Electric Corporation, Japan |
Publicity: | Noriyuki Iwamuro | University of Tsukuba, Japan |
Publication: | Wataru Saito | Kyushu University, Japan |
Sponsorship /Exhibition: |
Masaki Shiraishi | Hitachi Power Semiconductor Devices, Ltd., Japan |
Tatsuya Nishiwaki | Toshiba Electronic Devices & Storage Corporation, Japan | |
Local Arrangement: | Satoshi Shiraki | Denso Corporation, Japan |
Kota Oi | Fuji Electric Co., Ltd., Japan | |
Webmaster: | Masanori Tsukuda | Mitsubishi Electric Corporation, Japan |
Advisory Committee
Gehan Amaratunga | Cambridge University, UK |
Tat-Sing Paul Chow | Rensselaer Polytechnic Institute, USA |
Mohamed Darwish | MaxPower Semiconductor, USA |
Don Disney | Infineon Technologies, USA |
Oliver Häberlen | Infineon Technologies, Austria |
Dan Kinzer | Navitas Semiconductor, USA |
Leo Lorenz | ECPE, Germany |
Gourab Majumdar | Mitsubishi Electric Corporation, Japan |
Peter Moens | ON Semiconductors, Belgium |
Mutsuhiro Mori | Waseda University, Japan |
Hiromichi Ohashi | NPERC-J, Japan |
Yasukazu Seki | Fuji Electric Co., Ltd., Japan |
John Shen | Illinois Institute of Technology, USA |
Kuang Sheng | Zhejiang University, China |
M. Ayman Shibib | Vishay Siliconix, USA |
Johnny Sin | Hong Kong University of Science and Technology, China |
Jan Šonský | NXP Semiconductors, Belgium |
Yoshitaka Sugawara | Ibaraki University, Japan |
Richard K. Williams | Adventive Technology, USA |
Toshiaki Yachi | Tokyo University of Science, Japan |
Technical Program Committee
Chair: | Ichiro Omura | Kyushu Institute of Technology, Japan |
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Category 1: High Voltage Devices (HV)
Category chair: | Noriyuki Iwamuro | University of Tsukuba, Japan |
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Members: | Marina Antoniou | University of Warwick, UK |
Giovanni Breglio | University of Naples Federico II, Italy | |
Chiara Corvasce | Hitachi ABB Power Grids, Switzerland | |
Fred Fu | GaN Power International Inc., Canada | |
Shigeto Honda | Mitsubishi Electric Corporation, Japan | |
Xiaorong Luo | University of Electronic Science and Technology of China, China | |
Yuichi Onozawa | Fuji Electric, Japan | |
Yi Tang | Starpower Semiconductor, China | |
Jun Zeng | MaxPower Semiconductor, USA |
Category 2: Low Voltage Devices and Power IC Device Technology (LVT)
Category chair: | Takahiro Mori | Renesas Electronics Corp., Japan |
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Members: | Riccardo Depetro | STMicroelectronics, Italy |
Hiroki Fujii | Samsung Electronics, Korea | |
Mark Gajda | Nexperia, UK | |
David, Tsung-Yi Huang | TSMC, Taiwan | |
Sang-Gi Lee | Dongbu HiTek's, Korea | |
Tatsuya Nishiwaki | Toshiba Electronic Devices & Storage Corporation, Japan | |
Amit Paul | ON Semiconductor, USA | |
Ronghua Zhu | NXP Semiconductors, USA |
Category 3: Power IC Design (ICD)
Category chair: | Nicolas Rouger | CNRS, France |
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Members: | Katsumi Eikyu | Renesas Electronics Corp., Japan |
Kenji Hara | Hitachi, Japan | |
Xin Ming | University of Electronic Science and Technology of China, China | |
Wai Tung Ng | University of Toronto, Canada | |
John Pigott | NXP Semiconductors, USA | |
Budong (Albert) You | Silergy Corp., China | |
Alessandro Zafarana | ON Semiconductor, Italy | |
Jing Zhu | Southeast University, China |
Category 4: GaN and nitride base compound materials:
Device and Technology (GaN)
Category chair: | Hideyuki Okita | Panasonic, Japan |
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Members: | Sameh Khalil | Infineon Technologies, USA |
Yang Liu | Sun Yat-sen University, China | |
Elison Matioli | EPFL, Switzerland | |
Yoshinao Miura | AIST, Japan | |
Peter Moens | ON Semiconductor, Belgium | |
Tomas Palacios | Massachusetts Institute of Technology, USA | |
Niels Posthuma | IMEC, Belgium | |
Grace Xing | Cornell University, USA | |
Shu Yang | Zhejiang University, China | |
Jiun-Lei Yu | TSMC, Taiwan |
Category 5: SiC and other Materials: Devices & Technology (SiC)
Category chair: | Naruhisa Miura | Mitsubishi Electric Corporation, Japan |
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Members: | Ian Chan | Cyntec, Taiwan |
Ulrike Grossner | ETH, Switzerland | |
Hiroshi Kono | Toshiba Electronic Devices & Storage Corporation, Japan | |
Chwan Ying Lee | Hestia-Power Inc., Taiwan | |
Kevin Matocha | unaffiliated, USA | |
Andrei Petru Mihaila | Hitachi ABB Power Grids, Switzerland | |
Yasuhiko Onishi | Fuji Electric, Japan | |
Dethard Peters | Infineon Technologies, Germany | |
Sei-Hyung Ryu | Wolfspeed, USA | |
David Sheridan | Alpha & Omega Semiconductor, USA | |
Sid Sundaresan | GeneSiC, USA | |
Woongje Sung | SUNY Polytechnic Institute, USA | |
Jon Zhang | Fudan University, China |
Category 6: Module and Package Technologies:
System Integration in Package (PK)
Category chair: | Tomoyuki Miyoshi | Hitachi, Japan |
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Members: | Sven Berberich | Semikron, Germany |
Alberto Castellazzi | Kyoto University of Advanced Science, Japan | |
Wei-Chung Lo | Industrial Technology Research Institute (ITRI), Taiwan | |
Bassem Mouawad | Nottingham University, UK | |
Ichiro Omura | Kyushu Institute of Technology, Japan | |
Yang Xu | Tesla, USA |