Committee Members
Organizing Committee
| General Chair: | |
|---|---|
Kimimori Hamada |
PDPlus LLC., Japan |
| Technical Program Committee Chair: | |
Ichiro Omura |
Kyushu Institute of Technology, Japan |
| Past General Chair: | |
Oliver Haeberlen |
Infineon Technologies, Austria |
| Vice General Chair: | |
Wai Tung Ng |
University of Toronto, Canada |
Kevin Chen |
Hong Kong University of Science and Technology, China |
Nando Kaminski |
University of Bremen, Germany |
| Secretariat: | Kozo Kato | Mirise Technologies Corporation, Japan |
|---|---|---|
| Treasurer: | Tomohide Terashima | Mitsubishi Electric Corporation, Japan |
| Short Course: | Yuichi Onozawa | Fuji Electric Co., Ltd., Japan |
| Social Event: | Katsumi Nakamura | Mitsubishi Electric Corporation, Japan |
| Publicity: | Noriyuki Iwamuro | University of Tsukuba, Japan |
| Publication: | Wataru Saito | Kyushu University, Japan |
| Sponsorship /Exhibition: |
Masaki Shiraishi | Hitachi Power Semiconductor Devices, Ltd., Japan |
| Tatsuya Nishiwaki | Toshiba Electronic Devices & Storage Corporation, Japan | |
| Local Arrangement: | Satoshi Shiraki | Denso Corporation, Japan |
| Kota Oi | Fuji Electric Co., Ltd., Japan | |
| Webmaster: | Masanori Tsukuda | Mitsubishi Electric Corporation, Japan |
Advisory Committee
| Gehan Amaratunga | Cambridge University, UK |
| Tat-Sing Paul Chow | Rensselaer Polytechnic Institute, USA |
| Mohamed Darwish | MaxPower Semiconductor, USA |
| Don Disney | Infineon Technologies, USA |
| Oliver Häberlen | Infineon Technologies, Austria |
| Dan Kinzer | Navitas Semiconductor, USA |
| Leo Lorenz | ECPE, Germany |
| Gourab Majumdar | Mitsubishi Electric Corporation, Japan |
| Peter Moens | ON Semiconductors, Belgium |
| Mutsuhiro Mori | Waseda University, Japan |
| Hiromichi Ohashi | NPERC-J, Japan |
| Yasukazu Seki | Fuji Electric Co., Ltd., Japan |
| John Shen | Illinois Institute of Technology, USA |
| Kuang Sheng | Zhejiang University, China |
| M. Ayman Shibib | Vishay Siliconix, USA |
| Johnny Sin | Hong Kong University of Science and Technology, China |
| Jan Šonský | NXP Semiconductors, Belgium |
| Yoshitaka Sugawara | Ibaraki University, Japan |
| Richard K. Williams | Adventive Technology, USA |
| Toshiaki Yachi | Tokyo University of Science, Japan |
Technical Program Committee
| Chair: | Ichiro Omura | Kyushu Institute of Technology, Japan |
|---|
Category 1: High Voltage Devices (HV)
| Category chair: | Noriyuki Iwamuro | University of Tsukuba, Japan |
|---|---|---|
| Members: | Marina Antoniou | University of Warwick, UK |
| Giovanni Breglio | University of Naples Federico II, Italy | |
| Chiara Corvasce | Hitachi ABB Power Grids, Switzerland | |
| Fred Fu | GaN Power International Inc., Canada | |
| Shigeto Honda | Mitsubishi Electric Corporation, Japan | |
| Xiaorong Luo | University of Electronic Science and Technology of China, China | |
| Yuichi Onozawa | Fuji Electric, Japan | |
| Yi Tang | Starpower Semiconductor, China | |
| Jun Zeng | MaxPower Semiconductor, USA |
Category 2: Low Voltage Devices and Power IC Device Technology (LVT)
| Category chair: | Takahiro Mori | Renesas Electronics Corp., Japan |
|---|---|---|
| Members: | Riccardo Depetro | STMicroelectronics, Italy |
| Hiroki Fujii | Samsung Electronics, Korea | |
| Mark Gajda | Nexperia, UK | |
| David, Tsung-Yi Huang | TSMC, Taiwan | |
| Sang-Gi Lee | Dongbu HiTek's, Korea | |
| Tatsuya Nishiwaki | Toshiba Electronic Devices & Storage Corporation, Japan | |
| Amit Paul | ON Semiconductor, USA | |
| Ronghua Zhu | NXP Semiconductors, USA |
Category 3: Power IC Design (ICD)
| Category chair: | Nicolas Rouger | CNRS, France |
|---|---|---|
| Members: | Katsumi Eikyu | Renesas Electronics Corp., Japan |
| Kenji Hara | Hitachi, Japan | |
| Xin Ming | University of Electronic Science and Technology of China, China | |
| Wai Tung Ng | University of Toronto, Canada | |
| John Pigott | NXP Semiconductors, USA | |
| Budong (Albert) You | Silergy Corp., China | |
| Alessandro Zafarana | ON Semiconductor, Italy | |
| Jing Zhu | Southeast University, China |
Category 4: GaN and nitride base compound materials:
Device and Technology (GaN)
| Category chair: | Hideyuki Okita | Panasonic, Japan |
|---|---|---|
| Members: | Sameh Khalil | Infineon Technologies, USA |
| Yang Liu | Sun Yat-sen University, China | |
| Elison Matioli | EPFL, Switzerland | |
| Yoshinao Miura | AIST, Japan | |
| Peter Moens | ON Semiconductor, Belgium | |
| Tomas Palacios | Massachusetts Institute of Technology, USA | |
| Niels Posthuma | IMEC, Belgium | |
| Grace Xing | Cornell University, USA | |
| Shu Yang | Zhejiang University, China | |
| Jiun-Lei Yu | TSMC, Taiwan |
Category 5: SiC and other Materials: Devices & Technology (SiC)
| Category chair: | Naruhisa Miura | Mitsubishi Electric Corporation, Japan |
|---|---|---|
| Members: | Ian Chan | Cyntec, Taiwan |
| Ulrike Grossner | ETH, Switzerland | |
| Hiroshi Kono | Toshiba Electronic Devices & Storage Corporation, Japan | |
| Chwan Ying Lee | Hestia-Power Inc., Taiwan | |
| Kevin Matocha | unaffiliated, USA | |
| Andrei Petru Mihaila | Hitachi ABB Power Grids, Switzerland | |
| Yasuhiko Onishi | Fuji Electric, Japan | |
| Dethard Peters | Infineon Technologies, Germany | |
| Sei-Hyung Ryu | Wolfspeed, USA | |
| David Sheridan | Alpha & Omega Semiconductor, USA | |
| Sid Sundaresan | GeneSiC, USA | |
| Woongje Sung | SUNY Polytechnic Institute, USA | |
| Jon Zhang | Fudan University, China |
Category 6: Module and Package Technologies:
System Integration in Package (PK)
| Category chair: | Tomoyuki Miyoshi | Hitachi, Japan |
|---|---|---|
| Members: | Sven Berberich | Semikron, Germany |
| Alberto Castellazzi | Kyoto University of Advanced Science, Japan | |
| Wei-Chung Lo | Industrial Technology Research Institute (ITRI), Taiwan | |
| Bassem Mouawad | Nottingham University, UK | |
| Ichiro Omura | Kyushu Institute of Technology, Japan | |
| Yang Xu | Tesla, USA |
